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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems8221; used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat gener.
This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
This book provides a detailed review of power amplifiers, including classes and topologies rarely covered in books, and supplies sufficient information to allow the reader to design an entire amplifier system, and not just the power amplification stage. A central aim is to furnish readers with ideas on how to simplify the design process for a preferred power amplifier stage by introducing software-based routines in a programming language of their choice. The book is in two parts, the first focusing on power amplifier theory and the second on EDA concepts. Readers will gain enough knowledge of RF and microwave transmission theory, principles of active and passive device design and manufacturing, and power amplifier design concepts to allow them to quickly create their own programs, which will help to accelerate the transceiver design process. All circuit designers facing the challenge of designing an RF or microwave power amplifier for frequencies from 2 to 18 GHz will find this book to be a valuable asset.
Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities. Describes the expansion of the field into hot topics such as energy (photovoltaics) and medicine (bio-nanotechnology) Provides contributions from leading industry professionals in semiconductor micro- and nano-electronics Discusses the importance of micro- and nano-electronics in today’s rapidly changing and expanding information society Future Trends in Microelectronics: Journey into the Unknown is written for industry professionals and graduate students in engineering, physics, and nanotechnology. Serge Luryi, PhD, is a Distinguished Professor and Chair of Electrical and Computer Engineering at Stony Brook University, as well as the Director of New York State Center for Advanced Technology in Sensor Systems. He has worked in microelectronics for over 30 years, published over 250 papers and has been awarded 53 US patents. He is a Fellow of the IEEE, of the American Physical Society, and of the Optical Society of America. Jimmy Xu, PhD, is the Charles C. Tillinghast Jr. '32 University Professor of Engineering and Physics at Brown University. Prior to 1999, he was the James Ham Chair of Optoelectronics, as well as the Director of the Nortel Institute for Telecommunications at the University of Toronto. He has worked in microelectronics for over 30 years. He is a Fellow of the AAAS, APS, Guggenheim Foundation, IEEE, and the Institute of Physics. Alex Zaslavsky, PhD, is a Professor of Engineering and Physics at Brown University. During 2009-2012 he was a Visiting Senior Chair of Excellence at the Nanosciences Foundation in Grenoble, France. He has worked in microelectronics for over 25 years and has published over 130 journal papers and book chapters. He has been an editor of the Solid State Electronics international journal since 2003.

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